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(A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ” (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ” (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ” (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”
Electrical
Current Rating: 2 AMP Contact Resistance: 20mΩ Max. Insulation resistance: 1000 MΩ MIN. Dielectric withstanding voltage: AC 500 V
Environmental and Processing
Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range) LCP Suitable For: IR Reflow, Wave, Manual solder Nylon 6T Suitable For: IR Reflow, Wave, Manual solder PBT Suitable For: Manual solder
Questions?
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